Gyeon | Q2M Compound +

Gyeon Q²M Compound Plus is a heavy cutting paste that offers an enhanced level of scratch removal and high abrasion with minimal dust and limited secondary defects. Although it leaves light holograms, they are easily removed with one pass of Gyeon Q²M Polish.

Q²M Compound+ provides increased cutting power, capable of removing 1500-grit sanding marks without causing significant defects. The formula is water-based and contains high-quality Japanese abrasives, allowing for quick and easy removal of severe defects. Gyeon Compound Plus contains no silicone or fillers, making the pre-coating preparation and polish removal process much faster and easier.

Application:

Use a polishing machine of your choice (rotary, dual-action, or orbital with forced rotation). Spread at low revolutions. Work until fully diminished at medium revolutions. Wipe off with a high-quality microfiber cloth. Use a 1:1 dilution of IPA to remove the remaining product and inspect the effect. Reapply if necessary.

Available in 120ml and 1000ml bottles.